Combining universal programming technology, 8th Gen, with fine-pitch handling system, Model 3800-MK2 is capable of processing broad range of programmable devices, from largest QFP to smallest WLBGA. Vision and pneumatic systems provide critical Very Small Package support, achieving required accuracy and repeatability for packages as small as 1 x 0.5 mm. Highly configurable, system simultaneously supports tape, tray, tube, and marking.
This story is related to the following:Wafer Processing Systems