Home › GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies
 

Keywords :   


GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies

2013-11-22 14:18:12| Semiconductors - Topix.net

MILPITAS, Calif., Nov 21, 2013   -- GLOBALFOUNDRIES today unveiled details of a project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies.

Tags: model technologies packaging chip

Category:Electronics and Electrical

Latest from this category

All news
»
23.11
23.11 85
23.11DANCEWITHDRAGON2 811
23.11 N5000VSE
23.11EZY POWER EDIT6
23.11RR4
23.1126.5 HG
23.11VISSLA
More »