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Liquid Cooling Moves Onto The Chip For Denser Electronics

2015-10-06 07:11:51| rfglobalnet Home Page

Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are operating.

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