Skyworks offers a series of Trans-Tech, Inc. (TTI) microwave substrates that are designed to meet the demands of devices operating in the Ultra-High Frequency (UHF) to microwave frequency range. Features include a wide selection of 4πMs, no connectors, no housing, and ease of integration with dielectric substrates. These substrates have the option of metallization for thick film applications, and also offer low loss characteristics, temperature stability, and reduced size and weight for circuit miniaturization.