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› Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput Using R&S CMW500 And Qualcomm Gobi 9x35 Chipset
Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput Using R&S CMW500 And Qualcomm Gobi 9x35 Chipset
2014-02-28 02:08:36| rfglobalnet News Articles
In a joint effort, Rohde & Schwarz and Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35 chipset in compliance with 3GPP Release 10 for LTE-Advanced.
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Category:Telecommunications
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