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Tresky to Display T-6000 Die Bonder at SEMICON West 2013

2013-06-01 06:00:00| Industrial Newsroom - All News for Today

SWITZERLAND &ndash; Tresky, a worldwide leading manufacturer of micro-assembly and rework applications, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.<br /> <br /> The T-6000 Die Bonder is an all-purpose system for R&D, pilot and medium-size production. Die handling is standard from wafer, ...This story is related to the following:Materials and Material ProcessingWafer Coating Equipment | Conductive Adhesive Bonders | Bonderizing Machinery

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