Duluth, GA – Viscom today announced that it will exhibit the S3088 AOI system in Booth #427 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. The system will be displayed with the unique Quality Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.<br />
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Viscom’s S3088 solder joint inspection AOI is as well as its SPI 3-D solder ...This story is related to the following:Test and Measuring InstrumentsSearch for suppliers of: Solder Paste Inspection Systems | Inspection Systems | Automatic Optical Inspection Systems