Designed for testing double-sided boards, X40 PLUS captures both top and bottom sides within single pass. With real-time multi-angle image, system can record complete 3D inspection of assembly. Integrated reconstruction methods based on digital thomosynthesis enable defined evaluation of individual layers of board. With upgrade, system offers inspection speed increase of 18%. Assembly measuring 216 x 164 mm with more than 8,000 solder joints requires 40 sec for complete 3D X-ray inspection.