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Ziptronix And Fraunhofer IZM-ASSID Collaborate On Development Of Low-Cost 3D Integration Solutions
2015-11-24 06:54:06| electronicsweb Home Page
Ziptronix, Inc., a wholly owned subsidiary of Tessera Technologies, Inc. (“Tessera” or the “Company”) and the leader in low temperature wafer bonding technology, recently announced it has entered into a development agreement with Fraunhofer IZM-ASSID (“Fraunhofer”)
Tags: development
solutions
integration
collaborate
Category:Electronics and Electrical
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