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Jan. 29, 2013 1:03 p.m.Arizona copper mine to pay $60K fine over spill

2013-01-29 23:52:41| Waste Management - Topix.net

Authorities say a southern Arizona copper mine has agreed to pay a $60,000 fine to resolve water quality violations over a 2010 pipeline spill.

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Police: $700 worth of copper wiring stolen from The Hite Company

2013-01-27 16:36:01| Electronics - Topix.net

Springettsbury Township Police are looking for someone who broke into The Hite Company and stole copper wiring worth $700, according to a news release.

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Epec Engineered Technologies Acquires Industry Leading Heavy/Extreme Copper PCB Manufacturer ...

2013-01-21 06:00:00| Industrial Newsroom - All News for Today

New Bedford, MA - Leading build to print electronics manufacturer, Epec Engineered Technologies today announced the acquisition of Heavy/Extreme copper PCB manufacturer, UPE Inc. UPE was founded in 1990 to serve the power electronics industry with locations in Cleveland, OH and Ottawa, Canada. They focused on manufacturing printed circuits boards with heavy copper from 5 ounces up to 200 ounces. "Extreme copper technology is a growing part of the PCB industry and UPE is at the leading edge of ...

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Network Test System supports wideband copper and DSL testing. .

2013-01-17 14:30:08| Industrial Newsroom - All News for Today

Combining with FTB-1 platform's optical power meter, VFL, and fiber inspection probe, FTB-610 Wideband Copper Test Module and FTB-635 Wideband Copper and DSL Test Module create all-in-one FTTN/hybrid network troubleshooting platform. FTB-610 offers deep copper analysis, including SmartR™ test suite, which automatically runs all decisive copper tests and translates results into plain language. FTB-635 adds ADSL2+/VDSL2 test capabilities, including full vectoring and bonding support. This story is related to the following:Network Testers |

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Improve Thermal and Electrical Conductivity with Pure Copper

2013-01-17 09:57:11| rfglobalnet Products

CopperViaTM is a process used to fill vias with pure copper material in ceramic thin film substrates. This is done to provide a low cost and highly conductive electrical thermal path in the substrates. This process eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.

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