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New Industry Trend: Micro Irrigation Systems Market, 2012-2018

2013-03-19 04:15:32| Agriculture - Topix.net

The worldwide population is increasing at a rapid rate and it is imperative that food supply keeps pace with this increasing population.

Tags: systems market industry micro

 

Pharmaceutical Feeder For Micro Batch Compaction - MicroDyne

2013-03-19 02:00:38| dairynetwork Home Page

The microdosing unit from Alexanderwerk. For dry compaction of extremely small quantities in laboratory or process development.

Tags: micro pharmaceutical batch feeder

 
 

Differentiate Your Processing Solution With A First-to-Market Technology Incorporating Micro Donation Transactions At The Point Of Sale

2013-03-13 14:37:42| dairynetwork Downloads

Charitable Partnering in the Payment Industry Done Right! It’s everywhere we look these days, the poster supporting this charitable cause or the other. There are so many programs but they are not all created equal.

Tags: of point technology sale

 

AGC And nMode Solutions Launch Subsidiary Triton Micro Technologies To Develop Novel Via-Fill Technology For Advanced Semiconductor Packaging

2013-03-13 02:27:44| rfglobalnet News Articles

Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1M to co-found a subsidiary business,Triton Micro Technologies, to develop innovative via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

Tags: advanced technology solutions develop

 

AGC And nMode Solutions Launch Subsidiary Triton Micro Technologies To Develop Novel Via-Fill Technology For Advanced Semiconductor Packaging

2013-03-13 02:27:44| wirelessdesignonline News Articles

Leveraging synergies in their respective technologies, Tokyo-based Asahi Glass Co., Ltd. (AGC) and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1M to co-found a subsidiary business,Triton Micro Technologies, to develop innovative via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

Tags: advanced technology solutions develop

 

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