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Sierra Wireless AirPrime Embedded Module Selected By Lenovo For LTE-Advanced Notebooks, Tablets And 2-In-1s

2016-01-12 05:04:22| wirelessdesignonline News Articles

Sierra Wireless recently announced its AirPrime EM7455 embedded module has been selected by Lenovo to provide fast and reliable LTE-Advanced cellular connectivity in next-generation notebooks, tablets, and 2-in-1s.

Tags: selected wireless module sierra

 

Automated Module aids spectroscopic collection, model development.

2016-01-08 14:31:05| Industrial Newsroom - All News for Today

EDX Experiment Design and Execution Module automates spectroscopic data collection and chemometric model development. Without requiring duplicate manual data entry, functionality allows spectra to be collected using Symbion LX, DX, or RX and transferred directly to Symbion QT chemometrics. During collection, user can add variables, create component values spreadsheet, and annotate memo block for each spectrum. Users can also, upon deployment, add multiple trends based on calculations.

Tags: development model collection aids

 
 

Microchip's LoRa Wireless Module is World's First to Pass LoRa Alliance Certification; Ensures Interoperation of Long-range, low-power IoT Networks

2016-01-06 11:31:07| Industrial Newsroom - All News for Today

- Stack-on-Board RN2483 named golden-unit reference module for all future certifications; makes it easy to tap the long range and low power of LoRa wireless networks BANGKOK - Microchip Technology Inc., (NASDAQ: MCHP) a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has announced...

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6mm x 6mm, Longsys Technology launches The World's Smallest IoT WiFi SiP Module

2016-01-05 05:07:39| wirelessdesignonline News Articles

Longsys Technology, the leading solutions provider for the Internet of Things (IoT), just announced the world's smallest IoT WiFi Silicon-in-package (SiP) module, LTP0201, which is designed for IoT and wearable devices that can connect to other smart devices or directly connect to the Internet for cloud-based data analytics and enhanced services.

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ETX Module fosters targeted carrier board design via flexibility.

2015-12-30 14:31:04| Industrial Newsroom - All News for Today

Powered by 1.91 GHz quad-core Intel® Atom™ E3845 CPU SoC, 95 x 114 mm ET839 operates from -40 to +85°C and offers scalable performance that allows replacement/upgrade of Bay Trail-I ETX solutions without changing baseboard. Module supports up to 4 GB DDR3L SO-DIMM system memory and offers diverse I/O options. Integrated graphics enable dual independent displays via 24-bit dual channel LVDS and CRT graphics outputs with respective resolutions up to 1,600 x 1,200 and 2,048 x 1,536.

Tags: design board module carrier

 

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