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Test Module assesses high-speed I/O (HSIO) interfaces.

2015-03-05 14:31:09| Industrial Newsroom - All News for Today

Employing Xilinx FPGA, ChipVORX module FXT-X3/HSIO4 allows testing at board level and from inside, both in lab and in production, and can be connected to any Test Access Port (TAP). This serially controlled, universally adaptable tester supports GbE, PCIe, USB 3.0, and SATA interfaces with transfer rates in gigabit range. Availability of 4 slots makes module fully configurable, and Boundary Scan software SYSTEM CASCON enables automatic test generation and test execution.

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Type 10 COM Express Module features Intel Atom(TM) processor.

2015-03-05 14:31:08| Industrial Newsroom - All News for Today

Designed to accommodate Intel®'s Atom E3800 Series processor, NanoCOM-BT integrates up to 16 GB eMMC storage, up to 2 GB onboard DDR3L RAM, and Intel's I210-IT Ethernet controller on 84 x 55 mm board. Industrial-grade components operate in temperatures from -40 to 85°C while withstanding shock and vibration. Additional features include USB ports, SATA ports, LVDS, DDI, and PCI-E. With Hi-Safe Software, tasks such as watchdog timers, digital I/O control, and system monitoring can be performed.

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Remote I/O Module is programmable via FreeRTOS.

2015-03-05 14:31:08| Industrial Newsroom - All News for Today

Suitable for environmental monitoring and I/O control, RIO-2010PG is powered by 32-bit NXP LPC1768 100 MHz ARM Cortex M3 processor that has 64 KB SRAM, 512 KB Flash, and FreeRTOS operating system. Industrial I/O includes one 10/100 MHz Ethernet port, one full modem RS-232, one isolated RS-485, 8 channels of relay, 16 photo-isolated digital inputs, and one 1-wire interface for temperature or humidity sensor. FreeRTOS+lwIP BSP, device manager utility, and example programs are also included.

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Connected IO Develops Altair-Based Cellular Module for Internet of Things-Based Applications

2015-03-05 11:31:17| Industrial Newsroom - All News for Today

Verizon Certified, Semi-Rugged M2M Modem Provides 4G/LTE Connection for Wide Range of Products, from Vending Machines to Digital Signs SANTA CLARA, California and HOD HASHARON, Israel Connected IO (http://www.connectedio.com), a provider of embedded product engineering, software development and industrial design...

Tags: internet applications connected module

 

Type 6 COM Express Module withstands harsh environments.

2015-03-03 14:31:07| Industrial Newsroom - All News for Today

Featuring R-Series SoC from AMD for extensive graphics capabilities, Model bCOM6-L1700 supports up to 16 GB of soldered memory, 4 SATA interfaces, Gigabit Ethernet port, 8 USB 2.0 ports, 4 USB 3.0 ports, and either 8 GPIO ports or SD Card interface. Extended mechanical construction protects module, which is designed for optional conformal coating for greater resistance to moisture, dust, chemicals, and temperature extremes. Dynamic thermal management helps prevent damage.

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