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Tag: packaging
DSM to introduce new film technology for flexible food packaging applications
2013-10-03 01:00:00| Packaging Gateway
Netherlands-based life sciences company Royal DSM has developed new technology in an attempt to enhance the potential for polyamide 6 (PA6) in blown film for flexible food packaging.
Tags: technology
film
food
applications
Amcor Packaging Takes on World's Harshest Environment: Antarctica
2013-10-02 06:00:00| Industrial Newsroom - All News for Today
Global packaging leader Amcor, today announces its sponsorship of the 2013 Willis Resilience Expedition, providing state-of-the-art packaging used by teenage explorer and climate campaigner Parker Liautaud on his quest to break world records while trekking from the Antarctic coast to the South Pole.<br /> <br /> Nineteen year old Parker is attempting to create two world records including becoming the fastest and the youngest person to make the journey. During the expedition, Parker will also ...This story is related to the following:Packaging Products & EquipmentSearch for suppliers of: Protective Packaging
Tags: environment
takes
packaging
worlds
Bag Packaging Materials optimize retail shelf appeal.
2013-10-01 14:29:35| Industrial Newsroom - All News for Today
Providing high-gloss finish for maximum brand impact, Autobag® and SidePouch® Bags meld 48 gauge polyester to clear or white LLDPE sealant layer that can be pre-printed in up to 10 colors. Lamination protects printing between layers of film, guarding it from abrasion. For clarity in fresh produce applications, SidePouch Anti-Fog low-density polyethylene film features additive that minimizes film’s surface tension, spreading moisture into thin sheet, eliminating fog, and maximizing product visibility. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesVegetable Bags | Reclosable Plastic Bags | Custom Bags | Packaging Bags | Film Bags |
Tags: materials
retail
bag
appeal
Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
<a href="http://www.indium.com/">Indium Corporation</a>’s <a href="http://www.indium.com/biographies/hongwen-zhang/">Dr. HongWen Zhang</a>, Research Metallurgist, will present at the <a href="http://www.binghamton.edu/ieec/symposium2013/symposium2013.html">2013 Electronics Packaging Symposium</a> October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach ...
Tags: technology
present
electronics
corporation
Indium Corporation Technology Expert to Present at 2013 Electronics Packaging Symposium
2013-10-01 06:00:00| Industrial Newsroom - All News for Today
Indium Corporation’s Dr. HongWen Zhang, Research Metallurgist, will present at the 2013 Electronics Packaging Symposium October 15-16 at Binghamton University in Binghamton, New York.<br /> <br /> Dr. Zhang’s presentation, Processing, Reliability, and Corrosion Resistance of BiAgX for Die-Attach Applications, compares the corrosion resistance of BiAgX, a drop-in lead-free solder paste solution for high-temperature die-attach applications, to Pb/5Sn/2.5Ag and SAC305.<br /> <br ...
Tags: technology
present
electronics
corporation
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