je.st
news
Tag: demonstrates
ON Semiconductor Demonstrates High Efficiency 3D Sensor Stacking Technology
2015-01-12 11:31:08| Industrial Newsroom - All News for Today
CMOS image sensor technology delivers improved power, performance and size efficiency for future ON Semiconductor sensors for mobile and consumer applications Consumer Electronics Show (CES) LAS VEGAS, Nevada ON Semiconductor (Nasdaq: ONNN), driving energy efficient innovations, has successfully characterized...
Tags: high
technology
efficiency
sensor
Husky Showcases New Barrier Solution, Demonstrates Range of Innovative Technologies for Beverage Packaging, Medical and Hot Runners at NPE 2015
2015-01-12 11:31:08| Industrial Newsroom - All News for Today
BOLTON, Ontario Husky Injection Molding Systems today announced that at NPE 2015 (March 23 27, Orlando, Florida) it will be showcasing its latest technologies for the beverage packaging, medical and hot runner markets, demonstrating that it provides customers with the highest levels of quality, productivity and...
Tags: range
hot
medical
solution
ST demonstrates Docsis 3.1 platform at CES
2015-01-06 14:36:00| Telecompaper Headlines
(Telecompaper) STMicroelectronics will demonstrate its next-generation Docsis 3.1 platform supporting RDK-B broadband-enabled software stack at CES. Docsis 3.1 delivers up to 5 Gbps downstream and 2 Gbps upstream, better network capacity and energy efficiency, as well as lower latency to offer outstanding end-user experiences. Docsis 3.1 cable modems will be used by multiple system operators (MSOs) to satisfy surging consumer demand for high-speed data services such as 4K Ultra-HD, multi-screen video-streaming services, Cable IPTV, gaming, file sharing, and home security. Backward compatibility with legacy Docsis 3.0 network equipment provides operators with smooth migration paths. As operators plan to trial and introduce Docsis 3.1 equipment to their networks during 2015, ST is among the first to demonstrate a working platform.
Tags: ces
platform
demonstrates
docsis
ON Semiconductor Demonstrates High Efficiency 3D Sensor Stacking...
2015-01-06 04:40:39| Semiconductors - Topix.net
ON Semiconductor , driving energy efficient innovations, has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs. The technology has been successfully implemented and characterized on a test chip with 1.1-micron pixels and will be introduced in a product later this year.
Tags: high
efficiency
sensor
demonstrates
SINANO team demonstrates sulfurs theoretical capacity in Li-S cells using ultra-small nanoparticles at low discharging rate
2015-01-01 19:55:28| Green Car Congress
Sites : [44] [45] [46] [47] [48] [49] [50] [51] [52] [53] [54] [55] [56] [57] [58] [59] [60] [61] [62] [63] next »