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Tag: connectivity
Visteon to Unveil Advanced Connectivity Solutions in Multiple Vehicles at 2015 International CES
2015-01-07 11:30:54| Industrial Newsroom - All News for Today
Global Automotive Supplier Creates Value in Vehicles for Automakers, Dealers and Consumers LAS VEGAS - Visteon Corporation (NYSE: VC) will showcase advanced technology in three different passenger cars to demonstrate how it can increase a vehicle's value throughout its lifecycle by reducing warranty costs and...
Tags: international
advanced
multiple
solutions
MediaTek Reveals the Future of Premium Wireless Connectivity with Its New MT7615 SoC
2015-01-07 02:08:43| Wireless - Topix.net
MediaTek today announces the release of MT7615, the most advanced 802.11ac System on Chip for Wi-Fi connectivity. MediaTek once again demonstrates its commitment to leading Wi-Fi technology through the MU-MIMO and beamforming techniques deployed in MT7615.
Tags: future
premium
wireless
soc
IEEE adopts HDBaseT for Ultra HD connectivity
2015-01-06 20:30:48| Digital TV News
The HDBaseT Alliance and IEEE have announced that the HDBaseT standard has been approved by the IEEE Standards Association (IEEE-SA) Standards Board for adoption as part of the organizations standard portfolio.
Tags: ultra
ieee
connectivity
adopts
Skyworth and China Telecom launch smart TV with embedded G.hn powerline connectivity
2015-01-06 15:40:01| Digital TV News
Marvell (NASDAQ:MRVL) has announced that Skyworth and China Telecom have launched the world's first Smart TV with embedded G.hn powerline connectivity powered by Marvell's G.hn platform solution.
Tags: china
smart
launch
telecom
TE Connectivity Introduces 5 GHz Antenna And LTE Antenna For Consumer Devices, Connected Home And Internet Of Things
2015-01-06 07:07:44| wirelessdesignonline News Articles
TE Connectivity (TE), a world leader in connectivity, today introduced two standard antenna extensions — the 5 GHz antenna, which accommodates the new IEEE 802.11ac standard, and the 4G LTE antenna. These new embedded antennas address customers’ increasing needs for more compact components in their smaller and thinner devices.
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