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Tag: soc
Logic Modules foster rapid SoC and ASIC prototyping.
2013-06-03 14:29:45| Industrial Newsroom - All News for Today
Providing up to 4.1 million ASIC gates of capacity, 432 external I/O, and 16 channels of Gigabit Transceivers capable of running up to 10 Gbps, K7 TAI Logic Module allows project managers to deploy large number of FPGA-based prototypes for diverse tasks. Module is based on Xilinx 28 nm Kintex-7 FPGA devices and comes with TAI Player Pro runtime software. Hardware design, system verification, and software development processes can run concurrently to shorten overall project schedule. This story is related to the following:Test and Measuring InstrumentsControls and ControllersSearch for suppliers of: Rapid Prototyping Equipment & Systems | I/O Modules |
Tags: modules
rapid
logic
foster
Cavium to Demonstrate a Broad Range of New SoC Solutions for Enterprise, Service Provider, and ...
2013-06-03 06:00:00| Industrial Newsroom - All News for Today
Wide Range of Demonstrations of OCTEON®, OCTEON Fusion® and PureVu® Processors<br /> <br /> SAN JOSE, Calif. and TAIPEI, Taiwan – Cavium Inc, (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for networking, communications and the digital home, today announced a broad range of new SoC solutions for small-medium enterprise, service provider, 3G+ 4G small cells and HD wireless display applications at Computex 2013. Live product demonstrations ...This story is related to the following:Green & CleanSignal Processors | Communications Processors | Cores
Tags: and
service
range
solutions
ZigBee SoC fosters wireless connectivity integration.
2013-05-23 14:29:02| Industrial Newsroom - All News for Today
Integrating ARM® Cortex™-M3 MCU, memory, and hardware security engine in 8 x 8 mm QFN56 package, CC2538 aids development of ZigBee® wireless connectivity-enabled smart energy infrastructure, home and building automation, and intelligent lighting gateways. SoC supports ZigBee PRO, ZigBee Smart Energy™, and ZigBee Home Automation™ and lighting standards, promoting interoperability. Support is also provided for IP standards-based development using IEEE 802.15.4 and 6LoWPAN IPv6 networks. This story is related to the following:Electronic Components and DevicesMicrocontrollers (MCU's) | Digital Signal-Processor Chips | Electronic Automation Equipment | Home Automation Systems
Tags: wireless
integration
soc
connectivity
Microsemi Shipping Production-Qualified SmartFusion2 SoC FPGAs and Full-Featured Development Kit
2013-05-21 06:00:00| Industrial Newsroom - All News for Today
Microsemi Shipping Production-qualified SmartFusion2 SoC FPGAs and Full-featured Development Kit<br /> <br /> Company Delivers Unprecedented Integration of Mainstream FPGA Features with Advanced Security, Reliability and Low Power<br /> <br /> ALISO VIEJO, Calif. – Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced shipment of production-qualified SmartFusion®2 system-on-chip ...This story is related to the following:Electronic Components and DevicesComputer Hardware and PeripheralsChip Arrays | Gate Arrays | Memory Controllers | Network Controllers
Tags: development
shipping
kit
soc
MediaTek Launches The World's First Integrated Platform For Entry Smartphones Featuring Dual-Core HSPA+ SoC With Integrated 4-In-1 Connectivity
2013-05-06 10:11:46| wirelessdesignonline News Articles
MediaTek Inc., a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced the launch of its next-generation, dual-core smartphone platform-- the MT6572. MediaTek's MT6572 is the world's first dual-core SoC with integrated Wi-Fi, FM, GPS and Bluetooth functions targeted at the entry segment and also enables a cost-effective 4-layer PCB design.
Tags: entry
integrated
platform
featuring
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