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OEM Group Receives Repeat Order for AGHeatpulse RTP System from Leading LED Manufacturer
2015-07-14 12:31:14| Industrial Newsroom - All News for Today
Single wafer tool will be used for Rapid Thermal Processing of GaN-on-sapphire LED manufacturing in rapidly growing 150mm substrate LED market PHOENIX Global semiconductor capital equipment manufacturer OEM Group announced today that a leading maker of LED products has placed a repeat order for an AGHeatpulse...
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Rudolph Receives JetStep Lithography System Order from Leading OSAT for Copper Pillar Bump and Fan-Out Wafer Level Packaging Applications
2015-07-14 12:31:14| Industrial Newsroom - All News for Today
Use of one tool for multiple applications provides the customer a solution to achieve superior productivity at reduced cost Flanders, New Jersey Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300...
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Rudolph Receives JetStep Lithography System Order From Leading OSAT For Copper Pillar Bump And Fan-Out Wafer Level Packaging Applications
2015-07-10 03:23:23| metrologyworld Home Page
Rudolph Technologies, Inc. announced recently that a leading Taiwan-based outsourced assembly and test (OSAT) manufacturer has selected the JetStep W2300 Advanced Packaging Lithography System for the development of next-generation advanced packaging technology
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Leading Taiwan OSAT Adopts Zeta Instruments Metrology System For Advanced Semiconductor Manufacturing
2015-07-10 03:20:17| metrologyworld Home Page
Zeta Instruments, Inc., announced recently that a leading Taiwan based outsourced semiconductor assembly and test (OSAT) ordered its third Zeta-580 automated metrology system for production monitoring of advanced semiconductor packaging, including 2.5D interconnect and fan-out wafer level packaging (FOWLP)
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Leading Companies And Research Organizations Join Forces In FANTASTIC-5G Research Project To Speed Development Of A Flexible Air Interface Below 6 GHz For 5G Networks
2015-07-07 06:51:13| rfglobalnet News Articles
A group of 16 leading players in the field of telecommunications are joining forces to advance the development of a new air interface below 6 GHz for 5G networks.
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