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Additive for Copper Plating is suited for TSV filling.

2013-10-22 14:29:43| Industrial Newsroom - All News for Today

Single-component type additive for TSV (Through Silicone Via) copper plating aids semiconductor manufacturers stacking multiple chips into 3D structure. Bottom-up filling (copper deposition progress from bottom of via) avoids occurrence of defects in filled copper. Effective with TSVs of various sizes, additive is also effective with via holes of different sizes on same wafer. Perfect filling has been confirmed for range of via sizes, from 5–20 µm dia, and aspect ratios of 1 to 10. This story is related to the following:Additives

Tags: filling copper suited additive

Category:Industrial Goods and Services

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