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Batch Wet Processing System enhances semiconductor production.

2014-08-13 14:31:59| Industrial Newsroom - All News for Today

Used for metal liftoff in MEMS and compound semiconductor manufacturing, FluidJet™ eliminates device damage and minimizes chemical use. Gentle cleaning suits sensitive metal features and thin lines, while use of batch immersion processing removes metals and eliminates redeposition and defects. Self-cleaning tanks and accessible metal collection baskets facilitate complete reclamation of lifted metals, and strainer baskets can be emptied in minutes. This story is related to the following:Cleaning Products and EquipmentSearch for suppliers of: Semiconductor Wafer Plating & Cleaning Equipment

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