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Dry Film Negative Photoresist suits MEMS/CMOS applications.

2016-02-01 14:31:06| Industrial Newsroom - All News for Today

Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3010 Dry Film Negative Photoresist is available in thickness formats from 5–50 µm, ±5%. Film offers glass transition temperature of 158°C (By DMA Tan Delta) and moderate modulus of 3.5 GPa at 25°C. Hydrophobic in nature, product can withstand harsh environments including extreme moisture conditions and corrosive chemicals once cured. DF-3010 can be used in contact with EMS line of spin coatable photoresists.

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Category:Industrial Goods and Services

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