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Fundamentals And Applications Of Polyimide In 3D Thin Film Multilayer Circuitry
2013-07-03 03:17:32| rfglobalnet Downloads
Today, the cost and complexity of all platforms and systems in military and defense technologies are being challenged by the need for high functionality in smaller but less expensive architecture, especially in light of current national budget challenges.By Michael D. Casper, UltraSource, Inc.
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Category:Telecommunications