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Is Stress the Root of Tin Whisker Growth?
2013-11-01 06:00:00| Industrial Newsroom - All News for Today
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at 7th International Tin Whiskers Symposium, which will take place November 12–13, 2013 in Costa Mesa, CA. His presentation, "Real Time Study of Whiskers/Hillock Formation in Sn-Cu Systems During Thermal Cycling," will provide information on systematic experiments conducted to confirm that stress from intermetallics causes tin whiskers to form. This story is related to the following:Trade Associations
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Category:Industrial Goods and Services