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PACK EXPO International 2014: Bosch Showcases Secondary Packaging Solutions

2014-08-26 06:00:00| Industrial Newsroom - All News for Today

Strengthening position as single-source solutions provider<br /> Focus on flexibility and quick changeovers<br /> Improved ergonomics for workplace safety<br /> Efficiency and streamlined design for maximum OEE<br /> <br /> Chicago &ndash; At PACK EXPO International 2014, Bosch Packaging Technology, a leading supplier of processing and packaging solutions, will feature several technologies from its secondary packaging portfolio. The show will mark the North American debut of the Sigpack TTMC ...This story is related to the following:Box, Carton & Case Packers | Fill & Seal Form Machinery

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Category:Industrial Goods and Services

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