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Plasma Treatment Systems expand up to 6 chambers.
2015-08-25 14:31:06| Industrial Newsroom - All News for Today
Configurable with 2, 4, or 6 chambers, StratoSPHERE™ Series is intended for wafer-level packaging and 3D packaging applications. Systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations. Designed to handle semiconductor wafers up to 12 in. in diameter, systems can process thin wafers with or without carrier, depending upon wafer thickness.
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Category:Industrial Goods and Services