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Plasma Treatment Systems serve semiconductor applications.
2015-07-07 14:31:06| Industrial Newsroom - All News for Today
Targeting wafer-level and 3D packaging applications, TrophoSPHERE™ and StratoSPHERE™ support automated handling and processing of round or square wafers and perform descum, ashing, dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Troposphere is designed for high-throughput processing of semiconductor wafers and other flat substrates in sizes from 3–8 in. dia for wafers held in open cassettes, while StratoSPHERE handles semiconductor wafers up to 12 in. dia.
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Category:Industrial Goods and Services