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SRC And UC Berkeley Pursue More Cost-Effective Approach To 3D Chip Integration Compared To Current 3D Interconnect Solutions

2014-05-09 13:07:59| rfglobalnet News Articles

University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.

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