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Solder Alloy maximizes drop shock performance of electronics.

2013-08-15 14:30:48| Industrial Newsroom - All News for Today

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without compromising on thermal cycling. This story is related to the following:Solder Balls |

Tags: performance electronics drop shock

Category:Industrial Goods and Services

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