Exhibiting thermal resistance down to 0.08°C in.²/W @ 14 psi, Sarcon® PG80A low-compression force, putty-like thermal interface material suits applications that have delicate or wide-variation component heights and require 30%–90% material compression. Gap filler pad (13 W/m°K) gently conforms to component shapes and uneven surfaces to transfer heat from source to nearby heat sink or spreader. Sheet thicknesses of 0.5, 1.0, 1.5, and 2.0 mm are available, and max dimensions are 300 x 200 mm.