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Thin Bond Line Thermal Interface Material

2015-03-19 11:31:11| Industrial Newsroom - All News for Today

Carteret, NJ  Sarcon SG-26SL is an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound that exhibits a low thermal resistance. When dispensed between a component such as a CPU or power converter and a heat sink, this material delivers a thermal conductivity of 2.6 W/m°K...

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