Home Thin Cooling Device eliminates hot spots in compact electronics.
 

Keywords :   


Thin Cooling Device eliminates hot spots in compact electronics.

2015-03-23 13:31:09| Industrial Newsroom - All News for Today

At <1 mm thick, thin loop heat pipe helps prevent overheating of localized parts due to heat generated from internal components in such small, thin electronic devices as smartphones and tablets. Heat-transfer device consists of evaporator and condenser connected by pipes into loop with encapsulated working fluid. Evaporator features six 0.1 mm thick copper sheets stacked together and contains porous structure with numerous holes driving fluid with capillary action.

Tags: hot electronics device compact

Category:Industrial Goods and Services

Latest from this category

All news

15.09Your MANA RepFinder Profile
13.09A League of Their Own Womens Special Interest Group Invites You to Attend a MANAchat on September 26
Industrial Goods and Services »
21.09Atlantic Tropical Weather Outlook
21.09Eastern North Pacific Tropical Weather Outlook
20.09Labelexpo Americas highlights, Maxcess announces acquisition and more
20.09September Cattle on Feed as expected
20.09USDA announces major investment in meat and poultry processing
20.09Atlantic Tropical Weather Outlook
20.09Eastern North Pacific Tropical Weather Outlook
20.09This weeks lesson: Weaning matters in the cattle market
More »