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Thiele Technologies Exhibiting at Pack Expo 2014
2014-09-24 06:00:00| Industrial Newsroom - All News for Today
MINNEAPOLIS, Minn. – Thiele Technologies, Inc., a leading manufacturer of converting, placing, bagging, cartoning, case packing and palletizing equipment, will promote its latest technology and equipment at Pack Expo 2014, November 2 to 5 at McCormick Place in Chicago, Ill. A team of professionals from Thiele will be available in Booth S-2100 throughout the show to discuss the company's complete range of product offerings.<br /> <br /> With the recent acquisition of SYMACH (based in ...This story is related to the following:Materials and Material ProcessingPackaging Products & EquipmentSearch for suppliers of: Material Handling Rotators | Pallet Handling Equipment | Packaging Machinery | Stretch Wrapping Palletizers | Material Handling Palletizers
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exhibiting
TTM Technologies buying competitor
2014-09-23 18:22:51| Electronics - Topix.net
A western Wisconsin technology company says it's buying a competitor in a cash and stock deal worth $927 million. TTM Technologies, based in Chippewa Falls, makes printed circuit boards for electronic devices.
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buying
competitor
ttm
Newest API Technologies Patent Extends RF/Microwave IP For GPS And Asset Tracking Applications
2014-09-23 12:24:47| rfglobalnet News Articles
API Technologies Corp. ("API" or the "Company"), a leading provider of high performance RF/microwave, power, and security solutions for high-reliability applications, announced recently that it has been awarded a new patent for antenna technology for GPS and asset tracking applications.
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technologies
newest
gps
Research And Markets: Global RF Devices For Smart TV Market 2014-2018: Avago Technologies, Murata Manufacturing, RF Micro Devices, Skyworks & TriQuint Semiconductor Dominate The Market
2014-09-23 10:24:26| rfglobalnet News Articles
Research and Markets (http://www.researchandmarkets.com/research/7gw6kc/global_rf_devices) has announced the addition of the "Global RF Devices for Smart TV Market 2014-2018" report to their offering.
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research
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global
Molex Spotlights Interoperable 400G Technologies at ECOC 2014
2014-09-23 07:25:45| Electronics - Topix.net
OIF stand #525 features and other OIF member companies in physical and link layer demonstrations showcasing advanced 100G technologies for 400G data transmission over optical fiber, copper cables and backplanes. "Molex is pleased to bring state-of-the-art solutions to the 40th anniversary of the prestigious ECOC exhibition," states Scott Sommers, global group product manager, Molex.
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spotlights
interoperable
molex
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