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Cobar to Exhibit Water-Soluble LF3237 Solder Wire at SMTA Upper Midwest

2013-06-01 06:00:00| Industrial Newsroom - All News for Today

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit Balver Zinn water-soluble LF3237 Solder Wire in Booth #44 at the upcoming SMTA Upper Midwest Expo and Tech Forum, scheduled to take place Thursday, June 27, 2013 at the Embassy Suites in Bloomington, MN. LF3237 is a high activated water soluble flux formulation for special applications.<br /> <br /> LF3237 Solder Wire shows excellent soldering and wetting performance even on difficult surfaces. Due to the high halide ...This story is related to the following:Solder Wire

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Water-Soluble Solder Paste minimizes voids.

2013-05-03 14:28:05| Industrial Newsroom - All News for Today

Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15&ndash;30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance. This story is related to the following:Material Handling and Storage Sponsored by: Dalmec Inc - The Source for Manipulators and Moving TechnologiesFlux Filled Solder | Flux | Solder | Solder Paste Dispensers |

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