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Linpac introduces absorbent meat and fish packaging

2014-06-06 01:00:00| Packaging Gateway

European multi-material packaging manufacturer Linpac Packaging has unveiled the absorbent EPS-base LINslice packaging solution for meat and fish.

Tags: fish packaging meat introduces

 

Honeywell Introduces Console Design Based On Operator Input

2014-06-05 23:55:00| Chemical Processing

The console features enhancements to ergonomic design and displays.

Tags: based design input operator

 
 

Scaleo chip introduces 1st automotive MCU manufactured using GLOBALFOUNDRIES 55nm automotive-specific semiconductor platform

2014-06-05 11:30:46| Green Car Congress

Tags: automotive 1st platform chip

 

Skyworks Introduces Suite Of Breakthrough Ultra Low Noise Amplifiers

2014-06-05 10:48:46| rfglobalnet Home Page

Skyworks Solutions, Inc an innovator of high performance analog semiconductors enabling a broad range of end markets, recently unveiled a suite of new, ultra-low noise amplifiers (LNAs) for cellular infrastructure, wireless connectivity and broadcast communication applications.

Tags: low suite ultra noise

 

Valspar Introduces WeatherXL Crinkle Finish for Coil Coatings

2014-06-05 07:00:00| Coatings World Breaking News

Tags: finish introduces coil coatings

 

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