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SUSS MicroTec Launches Mask Aligner MA20 ...
2014-04-02 12:41:29| Semiconductors - Topix.net
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today.
Tags: mask
launches
suss
microtec
SUSS MicroTec Launches DSC300 Gen2: Next Generation Projection Scanner for Advanced Packaging
2014-03-04 20:27:41| Semiconductors - Topix.net
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the DSC300 Gen2 projection scanner today.
Tags: advanced
generation
packaging
scanner
SUSS MicroTec Delivers 25th Mask TrackPro
2014-01-15 06:00:00| Industrial Newsroom - All News for Today
Garching - SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has delivered its 25th Mask TrackPro System - the newest generation tool - to a leading Asian IDM at the end of 2013. This tool is a cleaning equipment for frontend photomasks in the semiconductor industry. The customer started the installation of this tool in December 2013 and will use it for cleaning and maintenance of optical masks for 193i Lithography in its ...This story is related to the following:Semiconductor Wafer Plating & Cleaning Equipment
SUSS MicroTec Installs ELP300 Excimer Laser Stepper At Fraunhofer IZM Berlin
2013-11-21 07:37:58| chemicalonline News Articles
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.
Tags: berlin
laser
installs
fraunhofer
SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM Berlin
2013-11-20 06:00:00| Industrial Newsroom - All News for Today
Garching – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing and processing of 100mm to 300mm wafers. The platform ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdWafer Processing Systems | Laser Machining |
Tags: berlin
laser
installs
fraunhofer