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SUSS MicroTec Launches Mask Aligner MA20 ...

2014-04-02 12:41:29| Semiconductors - Topix.net

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today.

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SUSS MicroTec Launches DSC300 Gen2: Next Generation Projection Scanner for Advanced Packaging

2014-03-04 20:27:41| Semiconductors - Topix.net

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the DSC300 Gen2 projection scanner today.

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SUSS MicroTec Delivers 25th Mask TrackPro

2014-01-15 06:00:00| Industrial Newsroom - All News for Today

Garching - SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has delivered its 25th Mask TrackPro System - the newest generation tool - to a leading Asian IDM at the end of 2013. This tool is a cleaning equipment for frontend photomasks in the semiconductor industry. The customer started the installation of this tool in December 2013 and will use it for cleaning and maintenance of optical masks for 193i Lithography in its ...This story is related to the following:Semiconductor Wafer Plating & Cleaning Equipment

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SUSS MicroTec Installs ELP300 Excimer Laser Stepper At Fraunhofer IZM Berlin

2013-11-21 07:37:58| chemicalonline News Articles

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin.

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SUSS MicroTec Installs ELP300 Excimer Laser Stepper at Fraunhofer IZM Berlin

2013-11-20 06:00:00| Industrial Newsroom - All News for Today

Garching – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing and processing of 100mm to 300mm wafers. The platform ...This story is related to the following:Machinery and Machining Tools Sponsored by: Haas Automation, Inc. - Category Sponsor AdWafer Processing Systems | Laser Machining |

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