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Dropbox Adopts Single Sign-On Technology

2013-05-22 15:48:00| TechWeb

Dropbox says any off-the-shelf or homegrown identity management system can be configured to automatically sign users into its service.

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PAI to Support ADB's Growth as it Strengthens Leadership in Airfield Technology Solutions

2013-05-22 15:35:00| Airport Technology

PAI Partners (PAI), a leading European private equity firm, has acquired ADB Airfield Solutions (ADB) from Montagu Private Equity.

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Evaluation Module provides intelligent display DLP technology.

2013-05-22 14:27:55| Industrial Newsroom - All News for Today

Based on 0.45 in. WXGA resolution DLP4500 chipset and 150 lumen LED light engine, DLP® LightCrafter™ 4500 helps developers create portable and stationary 3D measurement tools for machine vision and quality control scenarios, medical imaging devices, spectrometers, and augmented reality devices. DLPC350 digital controller brings chipset's more than 1.03 M micromirrors to life, while suite of mini HDMI, USB, I2C, and 24-bit RGB FPD-link ports enable connection with other devices. This story is related to the following:Electronic Components and DevicesSearch for suppliers of: Chip Sets

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New Intel CEO creates 'New Devices' division focused on 'cool technology'

2013-05-22 14:02:38| InfoWorld: Top News

Well, that didn't take long. A mere five days after Brian Krzanich took the reins as the new CEO of Intel, he's shaking things up at an organizational level.

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Indium Corporation Technology Expert to Present at ECTC

2013-05-22 06:00:00| Industrial Newsroom - All News for Today

<a href="http://www.indium.com/">Indium Corporation</a>&rsquo;s <a href="http://www.indium.com/biographies/ning-cheng-lee/">Dr. Ning-Cheng Lee</a>, Vice President of Technology, will give several presentations at the 63rd <a href="http://www.ectc.net/">Electronic Components and Technology Conference</a> (ECTC) May 28-31 in Las Vegas, NV.<br /> <ul> <li> Professional Development Course: Lead-Free Solder Joint Reliability &ndash; Material Consideration. This course will cover materials ...

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