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Avoid CO2 and Save N2 in Your Can Packaging Process with INDOSA proVac Technology

2013-04-16 11:36:00| Packaging Gateway

The new INDOSA can process centre CPC 127-10 machine, with its INDOSA proVac Technology, is a breakthrough in the manufacturing of modified atmosphere cans.

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ALMA's Thorburn And Microsoft's Tennenhouse To Present IMS2013 Closing Ceremonies On Wireless Technology And Impact On Innovation

2013-04-16 11:00:00| rfglobalnet News Articles

ALMA’s Department of Engineering Head and joint ALMA Observatory Project Manager, Michael Thorburn and Dr. David Tennenhouse, Corporate Vice President of Technology Policy for Microsoft, will present closing ceremony keynotes on Thursday, June 6 at the 2013 IEEE MTT-S International Microwave Symposium (IMS) in Seattle.

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ALMA's Thorburn And Microsoft's Tennenhouse To Present IMS2013 Closing Ceremonies On Wireless Technology And Impact On Innovation

2013-04-16 11:00:00| wirelessdesignonline News Articles

ALMA’s Department of Engineering Head and joint ALMA Observatory Project Manager, Michael Thorburn and Dr. David Tennenhouse, Corporate Vice President of Technology Policy for Microsoft, will present closing ceremony keynotes on Thursday, June 6 at the 2013 IEEE MTT-S International Microwave Symposium (IMS) in Seattle.

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Ejector Technology Available as Integrated Platform

2013-04-16 06:00:00| Chemical Processing

Piab, a supplier of industrial vacuum technology, offers its COAX technology in a new simplified integration platform called piCHIP.  COAX is an ejector technology based on a multi-stage concept for creating vacuum with compressed air.

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M/A-COM Technology Solutions Announces New Single Channel CMOS Driver

2013-04-16 03:47:41| rfglobalnet News Articles

M/A-COM Technology Solutions Inc. (M/A-COM), a leading supplier of high performance analog semiconductor solutions, introduced recently a new single channel CMOS Driver for Microwave Switching Applications.

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