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Schneider Packaging's High Speed Case Packing Solution for Gable Top Cartons Provides Optimum Sanitation

2015-09-14 12:31:15| Industrial Newsroom - All News for Today

At Pack Expo 2015, Las Vegas Convention Center, Las Vegas, Booth #C-3425 LAS VEGAS, NV  - Schneider Packaging will exhibit its gable top case packer at Pack Expo 2015, Las Vegas Convention Center, Booth C-3425. This solid-body, stainless steel case packer provides optimum sanitation and consistent...

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High Speed Elevated Array offers design density and flexibility.

2015-08-21 14:31:06| Industrial Newsroom - All News for Today

Supporting 28+ Gbps applications and PCIe®/XAUI specifications, SkyRay™ consists of one riser and 2 receptacles (TPAR/TPAF Series) that, when mated, provide elevated 35 mm stack height. High-density wafers inside riser have helical crossover design to reduce crosstalk in 100 Ω differential applications, and choice of 1, 2 or 3 module configurations is available with 50 differential pairs per module on staggered 1.50 mm x 1.75 mm pitch. Stack height aids airflow and accommodates misalignment.

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Sener wins California High Speed Line engineering contract

2015-07-24 01:00:00| Railway Technology

The California High-Speed Rail Authority (CHSRA) in the US has awarded a contract to Spain-based Sener for the development of engineering and environmental services for the 42-mile (72.4km) section between Palmdale and Burbank Airport.

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Jacobs wins design services contract for California High Speed Rail

2015-07-22 01:00:00| Railway Technology

Jacobs Engineering Group has secured a contract to provide design services for the Construction Package 2-3 (CP 2-3) of the California High Speed Rail (HSR) in the US.

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Understanding High Speed ADC Testing And Evaluation

2015-07-20 12:30:07| rfglobalnet Downloads

Application note with an in-depth discussion on production test methods used by High Speed Converter Group of Analog Devices, Inc., to evaluate high speed ADCs.

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