Home › applicationspecific
 

Keywords :   


Tag: applicationspecific

Inspection System offers application-specific configurations.

2013-07-30 14:30:06| Industrial Newsroom - All News for Today

With Metrology suite, NSX® 320 Automated Macro Defect Inspection System offers wafer level packaging configuration, which measures film thickness, thin remaining silicon thickness, surface topography, copper pillar height, and solder bump height. Advanced wafer level packaging configuration (2.5D) adds measurement of wafer profile, total stack thickness, and thick/thin RST, while 3DIC configuration is capable of all measurements plus via depth, trench depth, bonded wafer TTV, and adhesive layers. This story is related to the following:3D Inspection Systems | Inspection Equipment | Wafer Inspection Devices

Tags: system offers inspection configurations

 

Bosch Designs Application-Specific Integrated Circuits for MEMS Sensors in Dresden

2013-01-15 06:00:00| Industrial Newsroom - All News for Today

Focus on automotive and consumer applications <font face='Symbol'>·</font> Design of Integrated Circuits for customer-specific demands<br> <font face='Symbol'>·</font> Engagement in one of the most dynamic microelectronics centers in Europe Bosch has started its ASICs (Application-Specific Integrated Circuits) design activities for micro-electromechanical systems (MEMS) sensors in Dresden, Germany. These sensors are silicon-based and sense for instance motions, pressure or magnetic fields. ...This story is related to the following:Electronic Components and DevicesSearch for suppliers of: Motion Sensors | Microelectromechanical Systems (MEMS) | Telecommunications Integrated Circuits | Integrated Circuits (IC)

Tags: integrated designs bosch dresden

 

Sites : [1] [2]