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Heat Transfer Fluid Exhibits Durability

2015-04-27 16:21:58| Chemical Processing

Hydrogenated terphenyl chemistry expands temperature range for processing applications.

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Heat Transfer Fluid offers durability, high-temperature capacity.

2015-04-24 14:31:06| Industrial Newsroom - All News for Today

Paratherm™ HT has hydrogenated terphenyl chemistry and is formulated for closed-loop, liquid-phase heating to 650°F in fired heaters and 675°F in waste-heat recovery and full convection heaters used in gas processing, plastic/chemical production, waste-oil recovery, and biodiesel industries. Along with density of 8.34 lb/gal @25°C, properties include 700°F max film temperature, 52.0°F min startup temperature (300 cSt), and respective kinematic viscosities of 32.0 and 4.2 cSt at 40 and 100°C.

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Independent testing confirms the Qualcomm Snapdragon 810 has a heat problem

2015-04-23 22:21:07| Extremetech

The Snapdragon 810 has been rumored to run hot and tests have demonstrated it's no lie. The problem, however, isn't just with Qualcomm's chip -- it's the entire design philosophy behind thinner, lighter devices.

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Packaged Heat Exchangers heat and cool residences, businesses.

2015-04-23 14:31:07| Industrial Newsroom - All News for Today

Available in cooling with gas heat configuration, 2- to 5-ton capacity York LX Series heats and cools residential and light commercial buildings. Single-cabinet design, featuring exact-fit gas/electric hookups, facilitates installation and service. With 14 Seasonal Energy Efficiency Ratio rating, packaged units exceed US Department of Energy efficiency standards and feature corrosion-resistant copper tube/aluminum fin condenser coils, single-stage compressor, and single-stage gas heat.

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Microporous Copper Foam suits heat sink applications.

2015-04-23 14:31:07| Industrial Newsroom - All News for Today

Featuring pore sizes from 300–600 µm and relative density of around 37%, Microporous Copper Foam is produced by means of lost carbonate sintering process. Rigid, highly porous, and permeable structure is regular and uniform throughout, and provides controlled density of metal per unit volume. Supplied in disks and sheet ranging in thickness from 4–10 mm, foam is suited for liquid cooling, air cooling, heat exchangers, EMI shielding, and power electronics applications.

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