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LatticeGear Sells First LatticeAx 300 Cleaving System to X-FAB
2014-06-09 06:00:00| Industrial Newsroom - All News for Today
LatticeAx 300 provides fast, accurate cross-sectioning of samples for analysis — more accurately than manual methods and faster and less expensively than automated systems.<br /> <br /> Beaverton, Ore. – LatticeGear, a manufacturer of cost-effective cleaving solutions for semiconductor, solar and general materials analysis, announced today that it has shipped the first of its new LatticeAx™ 300 cleaving systems to X-FAB Silicon Foundries, a leading analog/mixed signal ...This story is related to the following:Wafer Processing Systems
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300 system
Corrugated Trim Removal System delivers 300 hits/sec.
2014-04-17 14:30:56| Industrial Newsroom - All News for Today
Designed for mid- to high-volume operations, Model TRS-2 removes corrugated trim to ensure proper gluing, and virtually eliminates production stops or post-production searches for bad boxes due to trim caught in glue station. Torque-limited DC motor produces up to 18,000 hits/min, optimizes worker safety, and provides quieter operation than air power. Adjustable to accommodate various sizes of corrugated sheet, system safely removes extra material with replaceable, wear-resistant straps. This story is related to the following:Trim Removal Systems |
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Tanan 300 Unmanned Aerial System (UAS)
2014-03-20 20:35:00| Naval Technology
Tanan 300 is a new generation vertical take-off and landing (VTOL) tactical unmanned aerial system (UAS) being built by Cassidian, an EADS company (now Airbus Defence and Space).
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aerial
unmanned
uas
PS Vita 3.00 system update detailed, adds PS4 support
2013-11-05 05:18:47| Wireless - Topix.net
Sony is prepping for the launch of the Playstation 4 in just a week and a half and released details Monday for a PS Vita system update that will allow the handheld to connect with the next-gen console.
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PVD System aids 300 mm power device manufacturing.
2013-09-09 14:30:33| Industrial Newsroom - All News for Today
With options that include modules for frontside thick aluminum processing and backside metal deposition on ultra-thin wafers, Sigma fxP addresses challenges faced while scaling power physical vapor deposition (PVD) processes up to 300 mm wafer size. System deposits thick Al layers at rates >1.4 µm/min without any yield destroying whiskers or extrusions. It also carries thin wafer handling hardware and uses film deposition stress control to maximize throughput with minimal wafer bow. This story is related to the following:Physical Vapor Deposition (PVD) Systems
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power
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