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Colombia gets ball rolling on new spectrum sale

2014-10-22 02:00:00| Total Telecom industry news

State to auction 25 MHz of spectrum in the 900 MHz and 1900 MHz bands next year.

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Government drops ball on climate change

2014-10-07 18:00:00| Climate Ark Climate Change & Global Warming Newsfeed

Age: Two weeks ago, when Prime Minister Tony Abbott spoke before the General Assembly of the United Nations, he named four dire problems facing the world: the dangers posed by the Islamic State in Iraq and the Levant (ISIL), Russia's destabilising influence in eastern Ukraine, the outbreak and spread of the Ebola virus in western Africa and the economic malaise that continues to afflict many countries. But Mr Abbott did not mention climate change at all. That failure was conspicuous because just two...

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Bonomi Introduces Valpres Series Ball Valves

2014-10-03 15:25:32| Chemical Processing

Bonomi North America introduced wafer stainless steel, full-port ball valves, a flow-enhancing alternative to high-performance butterfly valves in OEM applications, skid-mounted systems or any tightly-confined area.

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Why Finish Line Shot An Air Ball, Missing Q2 Views

2014-09-26 18:57:38| Apparel - Topix.net

"Our second-quarter results fell short of our expectations due to softness within elements of our basketball offering while our running business was up midsingle digits, driven by casual and performance styles," said CEO Glenn Lyon in a release. The sportswear chain's earnings were flat, year over year, at 54 cents a share, missing views by 6 cents.

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Solder Joint Encapsulant for Ball Bumping Applications: BP 256

2014-09-22 06:00:00| Industrial Newsroom - All News for Today

Albany, NY &ndash; YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.<br /> <br /> YINCAE&#39;s BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. ...This story is related to the following:Adhesives and SealantsSearch for suppliers of: Reflow Encapsulants |

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