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Fujitsu Introduces Ultra-Compact Bluetooth Low Energy Modules Using...
2014-01-10 10:40:31| Wireless - Topix.net
With increasing OEM development of compact and low-cost Bluetooth low energy devices and accessories, Fujitsu Components America has introduced a new family of ultra-compact, BLE modules based on the Nordic Semiconductor nRF51822 System-on-Chip .
Tags: low
energy
modules
bluetooth
Fujitsu Introduces Ultra-Compact Bluetooth Low Energy Modules Using Nordic Semiconductor Ultra-Low Power System-On-Chip
2014-01-10 01:17:34| rfglobalnet News Articles
With increasing OEM development of compact and low-cost Bluetooth low energy (BLE) devices and accessories, Fujitsu Components America has introduced a new family of ultra-compact, BLE modules based on the Nordic Semiconductor nRF51822 System-on-Chip (SoC).
Tags: power
low
energy
modules
Fujitsu Introduces Ultra-Compact Bluetooth Low Energy Modules Using Nordic Semiconductor Ultra-Low Power System-On-Chip
2014-01-10 01:17:34| wirelessdesignonline News Articles
With increasing OEM development of compact and low-cost Bluetooth low energy (BLE) devices and accessories, Fujitsu Components America has introduced a new family of ultra-compact, BLE modules based on the Nordic Semiconductor nRF51822 System-on-Chip (SoC).
Tags: power
low
energy
modules
Integrated CAM Software for SolidWorks offers MILL, TURN modules.
2013-12-20 14:28:24| Industrial Newsroom - All News for Today
VisualCAM 2014 for SolidWorks includes 2 CAM modules – VisualCAM-MILL for SolidWorks and VisualCAM-TURN for SolidWorks – that run within SolidWorks CAD program. Offering parametric design and CAM capabilities, VisualCAM-MILL for SolidWorks is optimized for usability, design associativity, and speed. Used to program 2-axis CNC turning centers or lathes, VisualCAM-TURN 2014 includes 2-axis turning machining methods for handling complex programming tasks.<br /> This story is related to the following:CAD/CAM Software
Tags: software
offers
turn
modules
FPGA-Based Modules come in XMC and 3U VPX form factors.
2013-12-20 14:28:23| Industrial Newsroom - All News for Today
Utilizing Virtex®-7 family of FPGAs, XPedite2470 3U VPX and XPedite2400 XMC Modules merge configurable I/O, DSP-level processing, and thermal efficiency to meet demanding RF signal acquisition, SDR, and DSP requirements. XPedite2470 provides 11 high-speed GTX lanes to backplane and 8 high-speed GTX lanes to on-card FMC site. Supporting 32 LVDS signals through P14 connector, XPedite2400 includes 14-bit DAC, 2 GB of DDR3 SDRAM, Gen3 PCI Express interface, and up to 10 GTX lanes. This story is related to the following:Digital Signal Processing Boards | Single Board, VPX Computers
Tags: form
factors
modules
vpx
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