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Thick Film Chip Resistor is made with sulfur-proof material.

2013-10-15 14:31:32| Industrial Newsroom - All News for Today

Made with sulfur-proof electrode material, RK73H-RT features precision tolerances of 0.5% and 1.0% and resistance range of 10 Ω to 10 MΩ. Power rating is from 1/16–1 W and TCR values are ±100 and ±200 ppm/°C. Operating from -55 to +155°C, AEC-Q200-qualified product uses thick metal glaze film to provide heat and weather resistance. Sizes range from 0402 up to 2512, and areas of use include industrial, automotive, transportation, telecommunication, and consumer applications. This story is related to the following:Thick Film Resistors | Chip Resistors

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Slow Food Charleston and Whole Foods presents fall film series

2013-10-12 10:51:00| Grocery - Topix.net

For the third year, Slow Food Charleston and Whole Foods Market will host a free fall film series for the public.

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Thin Film Chip Resistor operates to +155°C.

2013-10-11 14:30:42| Industrial Newsroom - All News for Today

Offered in 0603 case size, PATT features resistance range from 2.75 &Omega; to 120 k&Omega;, absolute TCR as low as ±25 ppm/°C, and laser-trimmed tolerances down to ±0.1%. AEC-Q200-qualified unit operates at temperatures to +155°C with 100% power, derated linearly to 0 mW power at +250°C. With load-life stability of <0.2 % at 155°C and full rated power for 1,000 hr, resistor is optimized for under-the-hood automotive applications, oil and gas exploration, telecommunications, and industrial equipment. This story is related to the following:Thin Film Resistors | Chip Resistors |

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Last Hours' Film Raises Issue Of Global-Warming-Induced Extinction

2013-10-11 06:09:59| pollutiononline Home Page

"We've been talking about rising sealevels and extreme weather events," said authorThom Hartmann."Now we need to talk about extinctions."

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AquaBased launches water-based adhesive for plastic film lamination

2013-10-09 01:00:00| Packaging Gateway

AquaBased Technologies has launched new water-based adhesive AquaTack 7001-PAA for the lamination of low-surface-energy plastic films and other plastic-to-plastic bonding applications.

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