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Lyle Model 125FT Inline Thermoformer, 25 x 25, FORM TRIM STACK

2014-05-02 14:30:44| ROR Sitemap for http://www.plastimach.com/

Lyle 125FT Thermoformer, <br />maximum mold size, 25' x 25',<br />pneumatic drive, 6'formed part height,<br />7' platen stroke, 32 ton form pressure rating,<br />28' maximum sheet width, <br />100' 4-index oven,<br />72 ton trim force,<br />480V 100 amp

Tags: form model stack inline

 

ZED MODEL 900FTS INLINE THERMOFORMER 10' x 15' FORM TRIM STACK

2014-05-02 14:30:41| ROR Sitemap for http://www.plastimach.com/

USED ZED MODEL 900FTS INLINE THERMOFORMER<br />8'x15' Platen size<br />Upper Heaters<br />Hydraulic Trim Station.<br />Stacker<br />FORM - TRIM - STACK

Tags: form model stack inline

 
 

US: Stack Wine goes clear with pack refresh

2014-04-30 16:26:00| Daily beverage news and comment - from just-drinks.com

Stack Wine has changed its packaging to make it clear to consumers the product consists of four separate glasses of wine.

Tags: clear pack wine stack

 

Low Energy Protocol Stack targets Bluetooth SoCs.

2014-04-16 14:30:30| Industrial Newsroom - All News for Today

Incorporating RF protocol and its associated management framework, S110 SoftDevice v7.0 is available for nRF51822 Bluetooth low energy and 2.4 GHz proprietary System-on-Chip as well as nRF51422 ANT&trade; and ANT/Bluetooth low energy multiprotocol SoCs. Product provides Over-The-Air Device Firmware Upgrade, concurrent Peripheral/Broadcaster roles, support for concurrent multiprotocol Bluetooth low energy/2.4 GHz RF proprietary operation, and compliance with Bluetooth v4.1. This story is related to the following:Wireless Communication Software

Tags: low energy bluetooth protocol

 

Nordic Semiconductor Announces Major New Release Of Its Bluetooth Low Energy Protocol Stack For nRF51 Series Including Over-The-Air Firmware Upgrade Capability And Bluetooth v4.1 Compliance

2014-04-15 08:29:27| wirelessdesignonline News Articles

Ultralow power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces S110 SoftDevice v7.0, the next major release of its Bluetooth® low energy stack, for the nRF51822 Bluetooth low energy and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT™ and ANT/Bluetooth low energy multiprotocol SoCs.

Tags: including low major series

 

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