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BPX Brazed Plate Heat Exchangers Withstand High Pressure and High Temperatures

2013-02-14 15:58:47| Chemical Processing

All four models have a design pressure of 435 psig, min/max design temperature of 310/450 degrees Fahrenheit.

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Thermoplastic Temporary Mounting Adhesive withstands high heat.

2013-01-23 14:30:26| Industrial Newsroom - All News for Today

Available in 7 ½ x 1 ¼ x 5/8 in. bars, Crystalbond™ 590 offers thermal and mechanical stability and is used to bond advanced ceramics, circuit boards, optical components, and semiconductors for dicing and polishing operations. Application is accomplished by preheating mounting plate to 300°F, melting and spreading adhesive in uniform layer, positioning part, and allowing assembly to cool. After machining, Crystalbond is dissolved in ultrasonic bath using isopropyl alcohol. This story is related to the following:Thermosetting & Thermoplastic Adhesives |

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