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Tag: devices
Nordic Semiconductor Releases World's Smallest Bluetooth Low Energy And ANT+ ICs To Target The Most Space-Constrained Wireless Accessories And Devices
2013-04-23 03:44:46| rfglobalnet News Articles
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the immediate availability of two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Tags: low
accessories
energy
target
Nordic Semiconductor Releases World's Smallest Bluetooth Low Energy And ANT+ ICs To Target The Most Space-Constrained Wireless Accessories And Devices
2013-04-23 03:44:46| wirelessdesignonline News Articles
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the immediate availability of two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Tags: low
accessories
energy
target
Nordic Semiconductor Releases World's Smallest Bluetooth Low Energy And ANT+ ICs To Target The Most Space-Constrained Wireless Accessories And Devices
2013-04-22 09:28:56| rfglobalnet News Articles
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA recently announces the immediate availability of two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Tags: low
accessories
energy
target
Nordic Semiconductor Releases World's Smallest Bluetooth Low Energy And ANT+ ICs To Target The Most Space-Constrained Wireless Accessories And Devices
2013-04-22 09:28:56| wirelessdesignonline News Articles
Ultra low power (ULP) RF specialist Nordic Semiconductor ASA recently announces the immediate availability of two wafer-level chip-scale package (WLCSP) variants of its existing QFN-packaged nRF51822 and nRF51422 SoCs (System-on-Chips) that will now join the company's class-leading nRF51 Series.
Tags: low
accessories
energy
target
Agilent Technologies 3-D EM Simulation Software Selected By STMicroelectronics For Developing Integrated Passive Devices
2013-04-22 08:24:10| rfglobalnet News Articles
Agilent Technologies Inc. recently announced that STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has selected Agilent's Electromagnetic Professional (EMPro) software for use in development of integrated passive devices (IPDs). ST's Protection & IPAD business unit in Tours, France is handling the development.
Tags: software
selected
technologies
developing
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