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Millivolt Pressure Sensors come in miniature DIP packages.
2015-08-07 14:31:09| Industrial Newsroom - All News for Today
Offering standard pressure ranges from 1–70 psi, XHB Series provides uncalibrated and uncompensated analog millivolt output signal. RoHS-compliant sensors come in miniature DIP housing that allows for space-conserving PCB mounting and OEM design flexibility. Areas of intended use include dry air and non-corrosive gas applications, including industrial and pneumatic controls, measurement instrumentation, and medical devices.
Tags: pressure
packages
dip
sensors
MLCCs deliver space-level reliability in 7 SMD packages.
2015-07-27 14:31:06| Industrial Newsroom - All News for Today
Qualified to MIL-PRF-123 for aerospace and military applications, surface-mount Multilayer Ceramic Chip Capacitors are available with BP and BX dielectrics in 7 body sizes ranging from 0805–2225. Devices with BP dielectric offer low capacitance down to 1.0 pF, temperature coefficient of capacitance of 0 ppm/°C ±30 ppm/°C from -55 to +125°C, and aging rate of 0% max per decade. BX devices provide higher capacitance to 470 nF, TCC of ±15% from -55 to +125°C, and aging rate of 1% max per decade.
Tags: deliver
packages
reliability
smd
Mayor's Adopted Budget FY 2015-16: PBOT General Fund Add Packages
2015-07-25 00:39:03| PortlandOnline
Funding allocated to PBOT from the City's FY2015-16 General Fund PDF Document, 204kbCategory: FY 2015-16 Budget + Financial Information
New Vishay Intertechnology MIL-PRF-123-Qualified MLCCs Deliver Space-Level Reliability In Seven SMD Packages
2015-07-24 07:57:35| rfglobalnet Home Page
Vishay Intertechnology, Inc. (NYSE:VSH) today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) qualified to MIL-PRF-123 for aerospace and military applications.
Tags: deliver
packages
reliability
smd
IXYS Announces The Expansion Of The Surface Mount Packages D2-Pak (TO-263) And D3-Pak (TO-268) Without Middle Terminal For Higher Creepage Distances
2015-07-24 04:31:01| electronicsweb Home Page
IXYS Corporation, a leader in power semiconductors and IC technologies for energy efficient products used in power conversion and motor control applications, announced recently the extension of the D2-Pak (TO-263) and D3-Pak (TO-268) packages without middle terminal for higher voltage solutions that require Surface Mount Devices (SMD) with enlarged creepage distances
Tags: middle
higher
surface
packages
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