je.st

Home › packages

Tag: packages

Solderable Coatings hermetically seal packages.

2014-04-29 14:31:09| Industrial Newsroom - All News for Today

Although silicon is most frequently used substrate, Thin Film Solderable Coatings and Face Metallization can be applied to virtually all commonly used optical materials. Products are typically used for hermetic sealing of sensitive packages. They can be combined with anti-reflective, bandpass, or precision custom coatings from UV out to longwave infrared wavelengths. Applications include infrared detectors, cameras, focal plane arrays, and other sealed sensors and/or detectors. This story is related to the following:Solderable Coatings | Thin Film Coatings

Tags: packages seal coatings hermetically

A New Era in Sheetfed Offset Begins for Packages Limited

2014-04-28 06:00:00| Industrial Newsroom - All News for Today

KBA Rapida 106 at one of the largest packaging printers in Pakistan A new era in sheetfed offset begins for Packages Limited A KBA Rapida with six inking units, coater and delivery extension went live in March at Packages Limited in Lahore, the second-largest city in Pakistan. This high performance press marks the beginning of a new era in sheetfed offset for the prominent packaging printer. Packages Limited was founded in 1956 as a result of a joint ...This story is related to the following:Offset Printing Presses For Printing On Formed Parts |

Tags: limited era packages begins

ULP Microcontrollers are available in compact packages.

2014-04-15 14:30:35| Industrial Newsroom - All News for Today

Helping developers conserve board space, MSP430™ ultra-low power (ULP) MCUs include FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 in WLCSPs as small as 2.0 x 2.2 x 0.3 mm. I/O (1.8 V) on MSP430F5229 MCUs enables applications with sensor fusion capabilities, while libraries and support facilitate USB development on MSP430F5528 MCUs in CE applications. Range of 1.8 and 5 V tolerant I/O on MSP430F51x2 MCUs fosters diverse component interface capabilities. This story is related to the following:Controls and ControllersGreen & CleanSearch for suppliers of: Integrated Circuits (IC)

Tags: packages compact microcontrollers ulp