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UltraSource, Inc. Announces Cost Effective Backside Treatment For Epoxy Adhesion Of Thin Film

2013-02-15 02:45:53| rfglobalnet News Articles

Michael Casper, President & CEO of UltraSource, Inc., a thin film ceramic microchip manufacturer is pleased to announce that they now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding.

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